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this is information on a product in full production. september 2015 docid026543 rev 4 1/13 13 BALF-NRG-01D3 50 ? nominal input / conjugate match balun to bluenrg transceiver, with integrated harmonic filter datasheet ? production data features ? 50 ? nominal input / conjugate match to bluenrg device ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? wafer level chip scale package (wlcsp) benefits ? very low profile: < 670 m ? high rf performance ? rf bom reduction ? small footprint applications ? bluetooth low energy impedance matched balun filter ? optimized for st bluenrg rfic description stmicroelectronics BALF-NRG-01D3 is an ultra miniature balun. the BALF-NRG-01D3 integrates matching network and harmonics filter. matching impedance has been customized for the bluenrg st transceiver (both qfn and wlcsp versions). it is using stmicroelectronics ipd technology on non conductive glass substrate which optimizes rf performance. figure 1. application schematic with qfn type bluenrg figure 2. application schematic with wlcsp type bluenrg flip-chip package 4 bumps www.st.com
characteristics BALF-NRG-01D3 2/13 docid026543 rev 4 1 characteristics table 1. absolute maximum ratings (limiting values) symbol parameter value unit min. typ. max. p in input power rfin - 10 dbm v esd esd ratings human body model (jesd22-a114-c), all i/o one at a time while others connected to gnd 2000 - v esd ratings machine model (mm: c = 200 pf, r = 25 ? , l = 500 nh) 200 - t op operating temperature -40 - +105 c table 2. impedances (t amb = 25 c) symbol parameter value unit min. typ. max. z diff nominal differential impedance - match to bluenrg - ? z ant antenna impedance - 50 - ? table 3. rf performance (t amb = 25 c) symbol parameter test condition value unit min. typ. max. f frequency range (bandwidth) 2400 2500 mhz s11 input return loss bandwidth -20 db s21 insertion loss -1.1 db s21 harmonic rejection (differential mode) h2 -8 db h3 -38 h4 -31 h5 -23 phase_imbal output phase imbalance 7 ampl_imbal output amplitude imbalance 0.5 db
docid026543 rev 4 3/13 BALF-NRG-01D3 characteristics figure 3. differential transmission figure 4. return loss g% i*+] g% i*+] figure 5. insertion loss figure 6. h2 filtering g% i*+] g% i*+] figure 7. h3 filtering figure 8. h4 filtering g% i*+] g% i*+]
characteristics BALF-NRG-01D3 4/13 docid026543 rev 4 figure 11. phase imbalance figure 9. h5 filtering figure 10. amplitude imbalance g% i*+] g% i*+] ghj i*+]
docid026543 rev 4 5/13 BALF-NRG-01D3 BALF-NRG-01D3 with qfn type bluenrg 2 BALF-NRG-01D3 with qfn type bluenrg figure 12. application board evb (2 layers) figure 13. recommended balun land pattern (evb) smt = 320 m 180 m 254 m top and spt = 220 m
BALF-NRG-01D3 with qfn type bluenrg BALF-NRG-01D3 6/13 docid026543 rev 4 2.1 BALF-NRG-01D3 measurements on qfn evb figure 16. pout figure 14. harmonics figure 15. sensitivity
docid026543 rev 4 7/13 BALF-NRG-01D3 BALF-NRG-01D3 with wlcsp type bluenrg 3 BALF-NRG-01D3 with wlcsp type bluenrg figure 17. recommended balun land pattern (wlcsp) figure 18. pcb stack-up recommendation 800 m 220 m
BALF-NRG-01D3 with wlcsp type bluenrg BALF-NRG-01D3 8/13 docid026543 rev 4 3.1 BALF-NRG-01D3 measurements on wlcsp evb figure 21. pout figure 19. harmonics figure 20. sensitivity
docid026543 rev 4 9/13 BALF-NRG-01D3 package information 4 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 4.1 flip-chip package information figure 22. flip-chip package outline ' ( i' i( $ $ fff $ ?e 6( ' ( %rwwrpylhz vlghylhz 7rsylhz
package information BALF-NRG-01D3 10/13 docid026543 rev 4 table 4. flip-chip package mechanical data dim. mm min. typ. max. a 0.580 0.630 0.680 a1 0.180 0.205 0.230 a2 0.380 0.40 0.420 b 0.230 0.255 0.280 d 1.375 1.40 1.425 d1 0.99 1 1.01 e 0.825 0.85 0.875 e1 0.39 0.4 0.41 se 0.2 fd 0.17 0.2 0.23 fe 0.195 0.225 0.255 ccc 0.05 $ 0.025 figure 23. footprint - 3 mils stencil -non solder mask defined figure 24. footprint - 3 mils stencil - solder mask defined &rsshusdggldphwhu ?puhfrpphqghg ?pplqlpxp ?ppd[lpxp 6roghupdvnrshqlqj ?puhfrpphqghg ?pplqlpxp ?ppd[lpxp 6roghuvwhqflorshqlqj ?puhfrpphqghg &rsshusdggldphwhu ?puhfrpphqghg ?pplqlpxp ?ppd[lpxp 6roghupdvnrshqlqj ?puhfrpphqghg ?pplqlpxp 6roghuvwhqflorshqlqj ?puhfrpphqghg figure 25. footprint - 5 mils stencil -non solder mask defined figure 26. footprint - 5 mils stencil - solder mask defined ghshqglqjrqsdvwhlwfdqjrgrzqwr?p &rsshusdggldphwhu ?puhfrpphqghg ?pplqlpxp ?ppd[lpxp 6roghupdvnrshqlqj ?puhfrpphqghg ?pplqlpxp ?ppd[lpxp 6roghuvwhqflorshqlqj ?puhfrpphqghg ghshqglqjrqsdvwhlwfdqjrgrzqwr?p &rsshusdggldphwhu ?puhfrpphqghg ?pplqlpxp ?ppd[lpxp 6roghupdvnrshqlqj ?puhfrpphqghg ?pplqlpxp 6roghuvwhqflorshqlqj ?puhfrpphqghg
docid026543 rev 4 11/13 BALF-NRG-01D3 package information 4.2 packing information figure 27. ball assignment figure 28. flip chip tape and reel specifications note: more information is available in the stmicroelectronics application notes: an2348 flip-chip: ?package description and recommendations for use? table 5. ball assignment details ball name description a1 ant antenna connection a2 gnd ground b1 rx_p balun receive positive output b2 rx_n balun receive negative output 'rwlghqwli\lqj3lq $orfdwlrq 8vhugluhfwlrqrixquhholqj $ooglphqvlrqvduhw\slfdoydoxhvlqpp ? ? ? ? ? ?? ? ? ? ? 67 67 67 [[] [[] [[] \zz \zz \zz
ordering information BALF-NRG-01D3 12/13 docid026543 rev 4 5 ordering information 6 revision history table 6. ordering information order code marking weight base qty delivery mode BALF-NRG-01D3 sv 1.35 mg 5000 tape and reel (7?) table 7. document revision history date revision changes 17-jun-2014 1 initial release 17-jul-2014 2 updated figure 13, figure 17, figure 22 and package view on cover page. corrected typo error on table 2. 18-aug-2014 3 updated title and description in cover page. 29-sep-2015 4 updated figure 22 . added figure 25 and figure 26 . reformatted to current standards.
docid026543 rev 4 13/13 BALF-NRG-01D3 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2015 stmicroelectronics ? all rights reserved

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